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DRV5011: Is it possible to use "underfill" in DRV5011ADYBHR (BGA package)

Conor
Guru 12175 points
Part Number: DRV5011

Hi,

Is it possible to use "underfill" in DRV5011ADYBHR (BGA package)? If available, I would like to know the following information.

1.Percentage of underfills used by customers using the DRV5011ADYBHR

2. Is there a manufacturer (including model) that we recommend?

3. Please let us know if you have any precautions when selecting an underfill material.

Thanks,

Astro

  • 0
    TI__Mastermind 21250 points

    Astro,

    Thank you for reaching out with your question.  For any TI device in a DSBGA package, we recommend the following:

    "TI DSBGA products are designed and tested to ensure excellent board-level thermal cycling reliability
    without the need for underfill in intended applications. If a customer chooses to underfill a DSBGA
    product, TI recommends following the guidelines below to maximize reliability.
    – The underfill fillet should extend partially up the die edges. Underfill that ends at the bottom (ball
    side) of the die will degrade reliability.
    – The underfill should have a CTE closely matched to the CTE of the solder interconnect.
    – The underfill should have a Tg above the expected maximum exposure temperature."

    I don't know that we have received any particular statistics regarding DRV5011ADYBHR using an underfill. I'm not aware of any particular manufacturer that is recommended above another, so my best recommendation is to follow the above guidelines for the best success.

    Thanks,

    Scott