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IWR1443: Voids allowed in VGA solder ball?

feng tang
Genius 3595 points
Part Number: IWR1443

Hi 

We see some voids in VGA solder ball of IWR1443 board, what percentage is allowed with these voids which not impact the performance of the boards?

Thanks,

  • 0
    TI__Genius 16240 points

    Hello,

    Thanks for reaching out to Texas Instruments.  I am reaching out to an Expert on this subject, please allow 48 hours for them to respond. 

    Best,

    -Shareef

  • 0 in reply to E. Shareef
    TI__Genius 16240 points

    There are many variables that would contribute towards percentage of voids that would effect performance.

    All BGA’s have micro and macro voids, There is no defect unless they are excessively large.

    According to Motorola study-Balls that contain voids up to 24% are more reliable than those without voids. so these voids are very tricky, so they can affect or have no effect, base on signal, current, voltage and conditions of the DUT during the issue.

    Also if the Reflow profile does not allow the air packets and flux evaporation, it could generate excessive voids.

    Hope this helps,

    -Shareef