Hi Team,
I need to follow up the thread :
I see some deviations after the solder process between 0.75mm up to 0.96mm. What would be the root cause of that? I just check the datasheet and there is just provided the max package size of 0.965 without any lower or typical bounds. Can you confirm that the AOP package has no deviations and the min/max size is only variation after the soldering for the overall component is only dependent of the different ball sizes deviations?
Thanks
Jens