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Original question:
LM35DT/NOPB/TI
The delaminations are extended to the resin/paddle interface, they are in the bonding zone, which is not acceptable on this type of component.
the delaminations are too big between the resin/paddle interface
1) Die Attached Epoxy overflow is common for this product type, and
2) The C-SAM observation is normal and acceptable?
