Dear Mr or Mrs,
I am working on a project involving PGA970. The goal of our electronics is to permite the use of 4-wires LVDS or, alternatively, of 3-wires LVDTs (hald bridge).
In our project we want to use the PGA970 to drive two LVDTs at the same time, one demodulated by S1 and one by S2 channels, so we monitor the secondary of one LVDT on S1 input and the secondary of the other one on S2 input, but we never monitor the excitation.
We are in an advanced phase of the project and we are now facing issues with temperature drifts. We found in software user's guide (application note SLDU024 PGA970 Software User's Guide (ti.com)) an example of temperature compensation firmware (page 18 of SLDU024) and we also found the same example in the reference firmware provided for the ARM M0 microcontroller integrated in the PGA970. As far as I understand, the example is intended to work for 5-wire connection, that is connecting one secondary of the LVDT to one demodulator input (S1) and the other one to the other demodulator (S2) and then calculating the measure as PADC = (S1-S2)/(S1+S2).
Can you confirm this?
Unfortunately this is not the connection we are using, so we require an alternative algorithm, able to teke in account the temperature drift of both waveform output and demodulator input.
Is there an alternative algorythm I can use to compensate the measurement in case I use 4-wire connection or 3-wire connection (only reading the LVDT secondary coil)?
I saw that the temperature-compensation formula involves many coefficients saved in FRAM (h0EE, h1EE, h2EE, g0EE...n2EE), which I imagine have different values from chip to chip.
What do those coefficint stand for? Maybe we could use those coefficint also for our purpose, but we require to understand better what they represent.
Do you have any suggestion?
Thank you in advance.
Best regards,
Alessandro