The datasheet of the TMP117 states not to solder the pad on the DRV (WSON) package. I was curious about this so I read the TI app note that gives some more information about solder-shift.
I'm a bit worried about the effect of mechanical stress on the device, because our application will cover the sensor with a heat-conductive epoxy in order to bond it to the product housing.
The app note mentioned that solder-shift is unpredictable, but I was wondering if anyone has any insight into the following questions:
- Is it possible to know whether the DRV (WSON) package or YBG (DSBGA) package would less susceptible to this mechanical shifting effect, when covered in epoxy?
- Would covering the device in epoxy have a similar effect to the solder-shift from soldering the die attached pad (DAP)?
Thank you for any information. I'm not particularly knowledgeable IC die bonding and package design. Being able to achieve 0.1 C without calibration would be excellent. Other than the solder-shift, this device would meet that requirement.
