IWR6843AOP: PCB Layoout Guideline for IC bottom side

Jack

Part Number: IWR6843AOP

Hi TI

I would like to make some inquiries for IWR6843AOP custom board layout.

1. How should my customer deal with the PCB pattern on the IC Bottom surface?
- Do they just need to process GND? Is there any additional work needed for heat dissipation?
- Should GND be processed and soldered?
(Looking at the IC sample, it doesn't appear to be soldering)
- Should IC Bottom Side PCB be free of copper foil?

2. They proceeded with PCB Artwork as below first, and it is PCB 2 Layer.
Should they separate GND into Analog GND and Digital GND as shown in the picture below?

Please answer to the questions regarding GND handlinig in PCB Layout

Thanks.

Regards,

Jack

over 2 years ago

0 Ankit Mohanty over 2 years ago

TI__Genius 9650 points

Hi,

We are looking into your query and will get back to you soon.

Regards

Ankit

0 Ankit Mohanty over 2 years ago in reply to Ankit Mohanty

TI__Genius 9650 points

1. You can refer to the design files present in TI website. They include the Schematic, Assembly, BOM, Altium Design and Layout files. You can use these files to fabricate the IWR6843AOP EVM.

https://www.ti.com/lit/zip/swrr166

https://www.ti.com/lit/zip/sprr418

Although it is not absolutely necessary, the thermal pad is beneficial to have for heat dissipation. A thermal interface (thermal pad) is present in the reference design file between the die and the PCB (with the solder mask removed) to aid in heat dissipation. Please refer to the below appnote for better understanding.

Thermal Design Guide for Antenna on Package mmWave Sensor (ti.com)

2. It is recommended not to have separate grounds.

Regards

Ankit

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IWR6843AOP: PCB Layoout Guideline for IC bottom side