TMP1075: Exposed Pad connection

Carsten Omet

Part Number: TMP1075

Dear support,

in the TMP1075DSG (WSON) with the exposed pad, it is not mentioned in the data sheet, if this pad should be connected to GND or not. Could you please clarify?

Best regards

over 1 year ago

0 Simon Rojas Avila over 1 year ago

TI__Expert 7170 points

Hi Carsten,

The exposed pad of the TMP1075DSG is not electrically connected to the internal die. The pad can be left floating and soldered to improve mechanical performance or it can be connected to a common ground plane when monitoring temperature of an IC on the PCB.

Best regards,

Simon Rojas

0 Carsten Omet over 1 year ago in reply to Simon Rojas Avila

Prodigy 10 points

Thank you very much.

... and which maximum voltage one could apply too the termal pad at maximum?

Best regards

0 Simon Rojas Avila over 1 year ago in reply to Carsten Omet

TI__Expert 7170 points

Hi Carsten,

Of course. Even though the thermal pad is not electrically connected to the die, this device has not been tested and is not rated for isolation. Therefore, TI does not spec/guarantee a breakdown voltage level of the thermal pad. The best practice would be to solder to GND or leave floating.

Best regards,

Simon Rojas

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TMP1075: Exposed Pad connection