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AWR2243: AWR2243 casecade crystal

Part Number: AWR2243
Other Parts Discussed in Thread: MMWCAS-RF-EVM

Hey:

About AWR2243 casecade crystal, 

Do you have crystal QVL list for reference?

Due to material shortage, can we choose aother cryatal (TXC) which spec is same as Kyocera (CX3225SA40000D0PTWCC)?

PS: AV40000003_TXC datatsheet as attached.

SX_AV40000003_TXC.PDF (1).pdf

CX3225SA40000D0PTWCC_DS.pdf

Thanks

BR

Jackson

  • Hey 

    Can we use 231017 E3SB40E00000EA)(HOSONIC) to replace Kyocera crystal?

    Have any effect for AER2243 performance?

    Have any timing or capacitor need to modify?

    HOSONIC_231017 E3SB40E00000EA V1.0.pdf

    Thanks

    BR

    Jackson

  • You should be able to use an alternate XTAL based on end application. 

    HOSONIC xtal is very similar to Kyocera xtal.

    Hope this helps,

    -E Shareef

  • Hey Shareef:

    Thanks for your reply.

    There are still a few questions to confirm:

    1. Do AWR2243 and LP87524 need to be baked before SMT? If so, what are the baking conditions?

    2. Does the AWR2243 component have the default DFP firmware in the chip?

    3. When we will update the latest DFP for AWR2243, does it follow mmwave_studio_user_guide document to update?

    PS: (a) We just modify radar antenna patent, the other layout and schematic refer to MMWCAS-RF-EVM design.

           (b) We use TDA2x_ADAS_tidm415a CRB (Customer Reference Board) as main board.

    4. The TX and RX trace isn’t equal length, which one is important for radar antenna pattern?  Equal length or bending ? The figure as below:

     Thanks

    BR

    Jackson

  • Hello Joackson,

    I will strongly encourage for the follow up questions to have their own separate e2e threads. 

    1. Yes, Baking is encouraged for long storage. Will need to confirm the conditions.

    2. Yes, all the mmWave Radar Chips come with default DFP firmware

    3. This is a question for my software colleagues

    4. We try to have as minimum bending as possible on the traces. Experience has shown that this has an effect on the Antenna. TX and RX lengths can be different, as long as they are properly matched and confirmed through simulations. 

    Thanks,

    -E. Shareef

  • Jackson - 

    To add some more guidance to what Shareef said about baking - these devices are MSL Level 3 rated. This means once the drypack is open, the parts can only be at room temp to 30°C/60%RH for 168 hours, before needing to be baked.  

    Please also reference this application note as well for complete guidance on MSL ratings and related details, too. https://www.ti.com/lit/an/spraby1a/spraby1a.pdf 

    excerpt from the app note, regarding the baking, too -

    from page 3 ==> Products that exceed their floor life can be re-worked with a bake to drive out residual moisture. The Reference Conditions for Drying Mounted or Unmounted SMD Packages table in IPC/JEDEC J-STD-033C provides guidance about the baking procedure and where you should take care to ensure that the plastic housing (trays, tape and reel or tubes) can withstand the temperatures being considered. Tape and Reel material should not be baked above 40°C due to risk of the packing material properties changes. A vacuum bake may be considered for IC packages without internal cavities.

  • Hey Shareef:

    Thanks for your reply.

    About poin4, due to limited layout area.

    If it isn't eaual length between TX trace, how will impact for radar performance?

    (  (e.g. TX1 length: 2038mil / TX2 length: 1770 mil / TX3 length: 2075mil)   

    If it isn't eaual length between RX trace, how will impact for radar performance?

    (  (e.g. RX1 length: 1000mil / RX2 length: 1000 mil / RX3 length: 1300mil / RX4 length: 800mil) 

    Thanks

    BR

    Jackson

  • Jackson,

    Can you raise a new e2e for this last question please?

    Thanks,

    E. Shareef

  • Hey Shareef:

    I am very sorru about this.

    I will creat a new case.

    Thanks

    Jackson