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HDC3021:How to do Bake/Rehydration, for which conditions it is necessary

husens
Prodigy 20 points
Part Number: HDC3021

I would like to ask my questions item by item.
1- Do both Baking/Rehydration need to be done together? is it enough if I do Rehydration?
2-Is it necessary to do Baking/Rehydration after smd assembly? What happens if I don't or if I do, will it help for sensitivity ?
3- did the sensitivity values given after smd assembly or after Baking/Rehydration in datasheet?
4- In which cases Baking/Rehydration process should be done.

  • 0
    TI__Genius 11985 points

    Hello,

    1. Baking removes moisure from the polymer on top of the sensor, and rehydration restores moisture. So they are not performed together, but at different times as needed

    2. After soldering/assembly, rehydration is necessary to restore moisture to the polymer. We recommend 5 days of continuous exposure to 25C/50% for the HDC3021. If you do not rehydrate the devices after assembly, they may read a negative RH error. We do not recommend baking after assembly.

    3. By sensitivitly, I am assuming you mean RH accuracy. Yes we take the effects of rehydration into account for the datasheet accuracy numbers. 

    4. Rehydration should be done after soldering & assembly. Baking should be done if you observe a positive RH error that makes the device out-of-spec. A 100C 2 hour bake should be sufficient to lower the device's humidity reading by eliminating excess moisture in the polymer.

    Regards

    -Alex Thompson