Team,
I did not see information about the title in the DS, may anyone can provide it to customer?
Customer need this for the thermal modeling, thanks.
Jeremy.
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Team,
I did not see information about the title in the DS, may anyone can provide it to customer?
Customer need this for the thermal modeling, thanks.
Jeremy.
Hi Jeremy,
The package dissipation spec includes the following footnote on junction-to-ambient thermal resistance: (5) Thermal resistance junction-to-ambient when attached to a double-sided printed circuit board with 1 oz. foil is 113 °C/W.
Best regards,
Simon Rojas