We are designing a PCB and would like to place the TMAG5273 sensor such that the hall elements are at a specific location on the board. From the datasheet, the hall element location is referenced to the edge of the package rather than the center of the package. This makes it unclear whether to use maximum dimensions (due to the draft angle of the package?) or the average dimensions (tolerances?) to determine the hall element offset from the center of the package. I.e. for the width, the hall element offset from the center is 0.195mm if using the maximum dimension or 0.12mm if using the average dimension. We are spinning the board soon and would appreciate a definitive answer on this.
It appears this question has been asked before here: https://e2e.ti.com/support/sensors-group/sensors/f/sensors-forum/1189429/tmag5273-exact-sensor-location-of-hall-elements-center-of-housing-as-reference-position?tisearch=e2e-sitesearch&keymatch=hall%2525252520element%2525252520location#
but the answer is still unclear, they just assumed to use the average.
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