TMAG5328: Concern about resin mold

Shunsuke Yamamoto

Part Number: TMAG5328

Hi team,

My customer plans to mold TMAG5328 into a resin. Are there any effects to electrical characteristics of TMAG5328 by a resin? For example, Bop get shifted due to a resin mold.

Best regards,

Shunsuke Yamamoto

over 1 year ago

0 Mekre Mesganaw over 1 year ago

TI__Expert 7495 points

Hi Yamamoto-san,

The team is out today on holiday. We should be able to get back to you with a response later this week.

Regards,

Mekre

+1 Scott Bryson over 1 year ago in reply to Mekre Mesganaw

TI__Mastermind 21120 points

Yamamoto-san,

It is possible that adding the resin mold onto the finished PCB would cause some package level stresses. It is possible see BOP/BRP get shifted as a result of stress on the package. It is likely that to get the most repeatable results for BOP, that the ADJ pin should be set after this mold is cured.

Thank you,

Scott

Sensors

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TMAG5328: Concern about resin mold