AWRL6432: Any concern to use underfill?

James Austrial

Expert 3530 points

Part Number: AWRL6432

Hi,

End customer suggest to use underfill to relieve vibration.

Do you have any concern if using underfill between mmWave IC device and PCB? Will it impact the RF performance?

over 1 year ago

0 Sreedeep K S over 1 year ago

TI__Intellectual 1560 points

Hi James,

Can you please elaborate on how they are going to have underfill between the package and the PCB without disrupting the soldering of the device onto PCB.

Thanks,

Sreedeep

0 James Austrial over 1 year ago in reply to Sreedeep K S

TI__Expert 3530 points

Hi Sreedeep,

From my understanding, the underfill procedure is after soldering and it won't disrupt.

+1 Sreedeep K S over 1 year ago in reply to James Austrial

TI__Intellectual 1560 points

James,

The underfill will be having different dielectric values and will impact the package to PCB transitions and thus the overall antenna performance. The effect will vary from board to board as the underfill may not be uniform.

Thanks,

Sreedeep

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AWRL6432: Any concern to use underfill?