We are using the TMP411BQDGKRQ1 on several boards in an enclosure we are doing thermal analysis on need to know some more information that is not in the datasheet. The datasheet lists a thermal resistance of 150°C/W but it doesn't say where the resistance is from or to. Do you have values for thermal resistance from junction to board, junction to case top, junction to case bottom, etc? We need this detail to perform our analysis.
Thanks
