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TMP114: some questions

Jeff YANG
Mastermind 6015 points
Part Number: TMP114

Hello,

I'd like to inquire about the contact method required for the TMP114 temperature sensor. Would it be feasible to use a metal conductor along with thermal adhesive for contact?

Regarding the type of metal, the size of the metal contact area, and the adhesive, are there any applicable documents or considerations to refer to?

Additionally, I would like to ask whether the surface of the IC can be in contact with CSP silicon or BGA plastic?

Thanks!

Jeff

  • +1
    TI__Expert 6295 points

    Hi Jeff,

    It all depends on what temperature you are trying to measure. For instance, when measuring temperature of a heat source present on the board you would want te device to be as close as possible to the heat source. On the other hand, if measuring ambient air, you may want to decouple the device from unwanted heat sources through layout techniques. Check out the following document on recommendations for measuring temperature in different use cases.

    Using a metal thermal conductor is a possibility but keep in mind that a larger thermal mass will decrease the thermal response of the device so it may take longer to see drastic changes in temperature. 

    Also keep in mind that TMP114 features a WCSP package in which the die is exposed at the bottom of the device. Therefore, any stress or strain on the device could affect the solder balls and cause mechanical damage on the device.

    In terms of being in contact with the mold compound, I don't see any issues as long as the material is not expected to conduct any charge. This is because the TMP114 is not qualified for any kind of isolation.

    Best regards,

    Simon Rojas

  • 0 in reply to Simon Rojas Avila
    Mastermind 6015 points

    Hi Simon,

    I can't access the link now, Would you please share it again?

    Thanks!

    Jeff

  • +1 in reply to Jeff YANG
    TI__Expert 6295 points

    Hi Jeff,

    Sorry about that, try this link and navigate to the technical resources section as seen below:

    The engineer's guide to temperature sensing contains layout recommendations that address your original question.

    Best regards,

    Simon Rojas