Good day colleagues,
Can you tell me whether the temperature measurement of the LMT87-Q1 is carried out via a specific pin, or whether all pins are equally well thermally connected to the sensor?
Thanks,
Daria
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Good day colleagues,
Can you tell me whether the temperature measurement of the LMT87-Q1 is carried out via a specific pin, or whether all pins are equally well thermally connected to the sensor?
Thanks,
Daria
Hi Daria,
There is no specific thermal pad as in other packages/devices. The thermal conduction to the die and sensing element in the die will be most effective through the pins of the device since the leadframe is in direct contact with the die. I would recommend looking into the following document for best practice layout recommendations:
Document can be found here: https://www.ti.com/sensors/temperature-sensors/overview.html.
Best regards,
Simon Rojas