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HDC3020-Q1: contamination check

Ryan Wang
Expert 6080 points
Part Number: HDC3020-Q1
Other Parts Discussed in Thread: HDC3020,

Dear expert,

Customer HDC3020 is already in mass production. But randomly, there is some HDC3020 report abnormal RH. After 24 hours back, the  HDC3020 become normal. Customer doubt there is some contamination, but they didn't find any contamination at the opening of the humidity sensor element. They wander whether they can ship some unit to BU to help them check whether these HDC3020 is polluted?

And does BU recommend them to program Integrated Heater during to solve this issue at production line? Is there any guide line to use  Integrated Heater?

Thanks

  • 0
    TI__Expert 5670 points

    Ryan,

    Could you please provide more detail on the "abnormal" result, and how it recovers? I wouldn't think a  chemical contamination could cause a transient error like that. Was it just one HDC3020? out of how many?

    Thanks

    -Alex Thompson

  • 0 in reply to Alex Thompson
    TI__Expert 6080 points

    Alex,

    The issue is described at below E2E:

    https://e2e.ti.com/support/sensors-group/sensors/f/sensors-forum/1335007/hdc3020-q1-abnormal-90-humidity/5082789#5082789

    Last time, after bake , they don't have problem any more. Then they leave it behind to continue mass production.

    But recently, there is still random several failure happen. After bake , the problem also disappear. But they want to send some chips back BU to check whether there is some contamination. (They cannot find by eye check)

    For your questions in last e2e:

    For the other 540pcs of HDC3020-Q1, did those all read 42% without issue (plus or minus a couple %RH)? 

    Yes, all around 42%RH

    Were all 600 pcs from the same lot or reel?  NO. NO apparent difference between good vs. bad. 

    the 60pcs that failed the 90% check, did they all read 100% or some RH value between 90% and 100%?

    It's  between 90% and 100%.

    Did temperature readings ever have any issue? temperature reading are all good.

    So do you mean baking can solve the problem indicate there is some liquid at sensor area?

    So  programming Integrated Heater can also solve the problem , right? Is there any guide line for Integrated Heater?

    Thanks

  • 0 in reply to Ryan Wang
    TI__Expert 5670 points

    Ryan,

    I cant promise that our BU will be able to find a potential contaminant. Is it possible that water condensation is forming which is causing either shorts or bad reads (or water in the sensor area)? and then the bake is fixing the issues? This behavior isnt typical of a chemical contamination.

    -Alex Thompson

  • 0 in reply to Alex Thompson
    TI__Expert 6080 points

    Alex,

    Thanks for feedback. 

  • 0 in reply to Ryan Wang
    TI__Expert 6080 points

    Alex,

    I still want to confirm whether "programming Integrated Heater" is recommended to customer to implement to fix this kind of issue in the field?

  • 0 in reply to Ryan Wang
    TI__Expert 6080 points

    Alex,

    Below is picture of bad unit which report non-accurate RH. Other similar silicon can be solved by 24 hour baking. This unit doesn't go through baking.

    Do you have any comment for this picture?

    I understand water condensation might be reason for this failure. But customer still wants to send back one unit back for ATE testing.  To avoid soldering, they cut the board to send silicon with board together.

    I will go through CQE process for ATE test as well. Thanks

  • 0 in reply to Ryan Wang
    TI__Expert 5670 points

    Ryan,

    Yes i would say that if baking fixes the issue, then using the heater (full power setting for 5 minutes at 3.3V) should be able to mimic the bake the customer is doing manually is the right thing to do in the field when this issue is seen. 

    Thank you for the great pictures of the sensor, I agree that I don't see any signs of contamination or debris. I agree that some of these failing units (that have not been baked yet) should be sent to the BU for ATE and RH chamber evaluation. I would like to see for myself this behavior and how the baking fixes the parts. I would start the customer return process, that way we can get ATE done quickly.

    After baking, does the issue ever reappear? if so, after how long? What is the bake condition that works best?

    Thanks

    -Alex Thompson