Tool/software:
Hello,
LM94021BIMGX/NOPB is listed under bare die https://www.ti.com/die-wafer-services/products.html#3278=Sensors&sort=1192;desc&.
But bond pad configuration data for the bare die is not available in the datasheet https://www.ti.com/lit/ds/symlink/lm94021.pdf?ts=1716791467133&ref_url=https%253A%252F%252Fwww.ti.com%252Fproduct%252FLM94021
Would you be able to provide us these requested details?.
Thanks,
Nischitha