• State Resolved
  • Locked Locked
  • Replies 4 replies
  • Subscribers 30 subscribers
  • Views 381 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TMP61: Center pin of TO-92 package

Atsushi Hirai
Expert 4960 points
Part Number: TMP61
Other Parts Discussed in Thread: STRIKE

Tool/software:

Hi team,

What is happened if the center pin shorted to pin1 or pin2? The center pin may be connected to the substrate.

Customer want to attach TMP61 at the end of harness and, there is a possibirity that it's shorted to pin1 or pin2, but it's not the both at once.

Regards,

  • 0
    TI__Expert 4960 points

    How about shorting to chassis(flame GND) or ESD strike?

  • +1 in reply to Atsushi Hirai
    TI__Expert 7170 points

    Hi Hirai-san,

    The middle pin on the TO-92 package is not bonded to any pads on the die. That being said, the device is not rated or qualified for any type of isolation so the outcome of an ESD event on this pin will be undetermined and could lead to some damage--this is because this pin extends to the leadfream on which the die sits.

    I do not see any issues with having this pin tied to GND (0V) but any voltage level above this could lead to damage of the device. 

    Best regards,

    Simon Rojas

  • 0 in reply to Simon Rojas Avila
    TI__Expert 4960 points

    Simon-san,

    Thank you for your reply.

    Customer want to cut the center lead by a nipper which is desiged to cut IC like below product.

    I think it should be no problem if there is no strong force for any direction. Is there any concern?

    CHP TR-20-TM Micro Nipper Cutter (hakkousa.com)

    Best Regards,

  • +1 in reply to Atsushi Hirai
    TI__Expert 7170 points

    Hi Hirai-san,

    This should not be a problem as long as the process is ESD-controlled. This is because the center pin is directly attached to the leadframe where the device sits so any ESD events at this pin could damage the device. There is also the mechanical/force aspect that should be taken into consideration. The only concern I would have with that would be damage to the bond-wires so I would recommend taking caution when performing this. Otherwise, the device will continue to work properly if there is no ESD or bond-wire damage. Hope this helps!

    Best regards,

    Simon Rojas