TMP61: Center pin of TO-92 package

Hi Hirai-san,

The middle pin on the TO-92 package is not bonded to any pads on the die. That being said, the device is not rated or qualified for any type of isolation so the outcome of an ESD event on this pin will be undetermined and could lead to some damage--this is because this pin extends to the leadfream on which the die sits.

I do not see any issues with having this pin tied to GND (0V) but any voltage level above this could lead to damage of the device. 

Best regards,

Simon Rojas

Hi Hirai-san,

This should not be a problem as long as the process is ESD-controlled. This is because the center pin is directly attached to the leadframe where the device sits so any ESD events at this pin could damage the device. There is also the mechanical/force aspect that should be taken into consideration. The only concern I would have with that would be damage to the bond-wires so I would recommend taking caution when performing this. Otherwise, the device will continue to work properly if there is no ESD or bond-wire damage. Hope this helps!

Best regards,

Simon Rojas