Tool/software:
Hai....., In the given document " TImmWaveRadarsensorRFPCBDesign,Manufacturing andValidationGuide " it is given :- L1 to L2, ground, microvia 1) 150 um drill diameter 2)300 um via L1 pad diameter.
Since our fabricator supports 1:1 aspect ratio for microvia,
If possible could you simulate our via transtions(200um drill and 450um pad) , the material we are using is Ro3003 with thickness 5mil.
Will there be any issue if we are going with our transtions.
Thank you.
