Tool/software:
Hi,
Could you please provide cross-section figure of HDC2010 for my customer Lumi?
Thank you.
(like this)
BR,
Yishan Chen
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Tool/software:
Hi,
Could you please provide cross-section figure of HDC2010 for my customer Lumi?
Thank you.
(like this)
BR,
Yishan Chen
Hi Ren,
Do we have any more specific description in HDC2010?(like show some internal structure
Thank you
Yishan Chen
This drawing has as much detail as the one you shared. DSBGA does not have a leadframe, bond wires or mold compound. It is just the silicon die and solder balls. This is the smallest and cheapest packaging possible. We don't share further detail on the construction of our die.
thanks,
ren