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AWR6843: chip-ID / Basic characteristic / Questionnaire

Hironori Yoshimura
Intellectual 1850 points
Part Number: AWR6843

Tool/software:

Background information.

my customer is working to utilize ChipID from the perspective of product and quality improvement.

mu Customer will also extract and record the ChipID of Radar module at the time of shipment.

Would you please kindly share following topics?

Q1) Measures to improve traceability (speed and accuracy) (how to keep records, etc.)

Q2) Radar module characteristics and characteristic correlation check at the IC level

Q3) if you have common questioner for first input case about AWR/IWR Radar devices?

  • 0
    TI__Expert 4190 points

    Hello,

    Please refer the following TIREX link for the 6843 device page, where you can find the necessary collaterals to get started: AWR6843 (ti.com)

    You can also find the documentation, example projects, training and applications of the mmWave radar sensors including 6843 devices at mmWave radar sensors (ti.com)

    Let us know if you are looking at any specific details on the device and they are not available on the TIREX. 

    Thanks.

  • 0 in reply to Voona Deexith
    TI__Expert 3465 points

    Hello 

    I assume I know these information.

    At first, what we would like to know is this answer.

    Q0) If AWR6843 has the dedicated "Chip ID" like MAC address of Wifi device or BT address of Bluetooth Device.?

    If it has "chip ID", then  our customer wants to clarify if it can utilize for the following each action if the failure happened in the production or market..

    Q1) Measures to improve traceability if failure happen . (ie, is it specify up to the wafer address?)

    Q2) Radar module characteristics and characteristic correlation check at the IC level

    Can you please comment for these questions?

    Regards,

    A.Fujinaka

  • 0 in reply to Akihiko Fujinaka
    TI__Expert 4190 points

    Hi Fujinaka-San,

    Thanks for clarifying your question.

    • Yes, the die ID of the device can be used to identify the wafer and lot.
    • Yes, Die ID will be helpful in tracing the device back to wafer level.
    • Could you kindly elaborate on what you mean by characteristics correlation check? 

    Thanks.

  • 0 in reply to Voona Deexith
    TI__Expert 3465 points

    Hello 

    Thanks for your reply. 

    Our customer wants to discuss about how each side (TI and customer) can utilize this ID information. Current their idea is, 

    1. Characterization  correlation : our customer wants to check their performance on their board with the TI's performance data when something/issue happen,

    2. In case the performance issue happened at the customer factory in production process or  market,  our customer wants to read and provide such "chip ID" with TI , then would like to utilize this for the issue cause.

    Regards,

    A.Fujinaka

  • 0 in reply to Akihiko Fujinaka
    TI__Expert 4190 points

    Hi Fujinaka-San,

    The customer can perform the same exercise on both the customer board and the EVM for evaluating the performance. The customer can refer the datasheet for details such as Noise figure, Tx power, etc.

    Also, if only some of the customer boards are having the problem and this problem has been root caused to the device performance then the customer can read the die ID and share it with TI for further debugging.  

    Thanks.