AWRL6432: How about the different CTE(Coefficient of Thermal Expansion) impact of Solder Ball vs. Acrylic CE-1171?

Ann Lu

Part Number: AWRL6432

Tool/software:

Cytec-CE-1171-Conap-Acrylic-Dielectric-Conformal-Coating.pdfFor specific requirement, the Acrylic CE-1171 is going to used as underfill material under AWRL6432, how about the different CTE(Coefficient of Thermal Expansion) impact of Solder Ball vs. Acrylic CE-1171?

8 months ago

0 Sivaprasad K L 8 months ago

TI__Intellectual 1860 points

Hi Ann,

Thanks for reaching out to us in E2E. Could you confirm whether you are referring to the material filled between Solder ball and the top layer of PCB?

Regards,
Sivaprasad

0 Ann Lu 7 months ago in reply to Sivaprasad K L

Prodigy 60 points

Yes. We are using CE-1171 as the material which will be filled between the none solder paste area of AWRL6432 & PCB top.

0 Ann Lu 7 months ago in reply to Ann Lu

Prodigy 60 points

By refer to the following link:

https://www.engineeringtoolbox.com/linear-expansion-coefficients-d_95.html

For CE-1171 is Acrylic & AWRL6432 solder ball major part is Tin, the CTE have the following difference. How about TI’s experience if it will cause reliability issue & can share related suggestion?