Tool/software:
Hello,
We are using the TMP116 for solid object measurements, with the device soldered to a PCB (including the thermal pad). A recent batch of PCBs from our vendor has shown a failure rate of approximately 1% (7-10 sensors out of 1200) after a few days of use, where the sensor experiences intermittent communication failures.
We've observed that the sensor becomes highly sensitive to mechanical stress—a slight bend or twist in the PCB results in a communication failure. In most cases, communication is restored after the mechanical stress is relieved and the sensor is power cycled. However, recovery can sometimes take a few hours. Simple continuity testing does not reveal any issues with the connections or solder joints.
I have a few questions:
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Has anyone encountered similar issues, and if so, is there a method to screen for mechanical strain or stress on the sensor?
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Can we safely assume that the intermittent failures are more likely related to the PCB rather than the sensor itself?
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In such cases, is it possible to recover communication by issuing a general-call reset?
Thank you,
Yassine
