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IWRL6432AOP: IS glue will affect mmWave performance?

Daniel Cheng1
Mastermind 7055 points
Part Number: IWRL6432AOP

Tool/software:

Hi Expert,

One question need your help to check, we found IWRL6432AOP IC is de-assembly from PCB board after our internal drop test. Normal process we will add glue around corner of chip or use underfill process to enhance this portion.

Want to know, is this glue will affect mmWave performance or any concern need to take care?

Do other customers have similar issues?

Thanks

Daniel

  • 0
    TI__Expert 4280 points

    Daniel, 

    For your question about glue affecting the performance of the radar, i have to give a "qualifed no". By that I mean there are some conditions which must be mantained for that to hold true. The first will be that the underfill should not portrude out from under the package. Any glue material "peaking out" will interact with the antenna near-field and degrade antenna performance. Second, care should be taken to ensure thatt he exposed die and recomended exposed copper pad below the die are unobstructed. This is to ensure proper thermal regulation of the part by radiating heat into the PCB copper layer. underfill between these parts could cause poor thermal performance of the radar.

    Lastly, I'm not aware of any customers facing this issue. I would recomend investigating the quality of the PCBs supplied by the PCB vendor. 

    Thanks!

    Blake