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ISOTMP35: Information on application

Kosta Kotsis
Prodigy 60 points
Part Number: ISOTMP35

Tool/software:

Hello all,

I am on the process of the conceptual desing of a drive. In this drive I am planning to use TSC (top side cooled) MOSFETs. The whole package is roughtly 15mmx15mm and is a half bridge.

In previous designs, for the temperature measurement of the mosfets I have either used PT1000s or the integrated temperature sensor in the package of the transistor (mostly when I have worked with power modules).

For this design however, I wanted to do something different. 

Since I am planning to have all the domains of the drive in one PCB board, and packaging size and simplicity are important, I was wondering if using a temperature sensor like ISOTMP35 and placing it close to my MOSFETs makes sense. In an application note from TI, I see that this type of sensor can also be used for GaN/SiC or Power Mosfets however, I am not sure how I would have to manage its placement with respect to this TSC MOSFET and if it is even advisable to use this sensor for such MOSFETs.

I have been trying to find application notes or documents (from TI) that touch upon this subject, but I haven't been able to find anything. 

So if anyone of you has used these sensors for such applications, has documents related to it, or any advice, I would really appreacite it. 

Thanks in advance,

K.K

  • 0
    TI__Expert 6100 points

    Hi Kosta,

    Thanks for reaching out. Our team is currently working on creating this exact content, we should have at least one application note on the placement of ISOTMP released next year.

    What voltage is your MOSFET operating at, and what temperature levels are you trying to sense? For placing the ISOTMP35, it is best to place the ISOTMP35 along the isolation boundary (if possible), or route the low voltage ISOTMP35 output from the HV side to the LV side (while taking care not to violate creepage and clearance). I would try and connect the HV side of the ISOTMP35 as close as possible to your MOSFET, through a shared copper pad or plane. 

    Regards

    -Alex Thompson