AWR2944: Power dissipation details required for thermal simulation

Ariparanthaman Selvarajan

Prodigy 225 points

Part Number: AWR2944

Tool/software:

Hi Ti team,

We required Power disipation details for the below cases to process the thermal simulation. Please provide the same.

8 months ago

0 E. Shareef 8 months ago

TI__Genius 15920 points

The table defines the description of how the device is setup for the corresponding power dissipation. If additional details are needed, can you please elaborate on the request?

-E. Shareef

0 Ariparanthaman Selvarajan 8 months ago in reply to E. Shareef

Prodigy 225 points

Hi Shareef,

By calculating the total maximum power cosumption, it is coming around 5.85W. since it have antenna, we are expecting considerable amount of power emit through antenna.

so, Power dissipation = Power consumption - RF power emission.

We want to know power dissipation for thermal simulation activity of our product.

Please share your thoughts.

0 E. Shareef 8 months ago in reply to Ariparanthaman Selvarajan

TI__Genius 15920 points

Power Consumption of 5.85W seems very high. Is this for 100% duty cycle?

+1 aozer 8 months ago in reply to Ariparanthaman Selvarajan

TI__Mastermind 29985 points

Hello,

There is no way to accurately predict the power dissipation by calculation. There will be natural convection via air through the top of the package, heat transfer through the PCB, etc which will all change with your environment and PCB design.

If you want to accurately do a thermal simulation you need to get the Icepak thermal model which we provide through NDA only. Then, through Ansys you can simulate thermal performance using your PCB and the package Icepak model. In order to get this thermal model you need to reach out to your local field sales office and obtain an NDA.

Regards,

Adrian

0 Ariparanthaman Selvarajan 8 months ago in reply to aozer

Prodigy 225 points

Hi Aozer,

Understood. so i need to given power consumption and Icepack model as input to thermal simulation.

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AWR2944: Power dissipation details required for thermal simulation