Tool/software:
Dears，
1.1843AOP BGA package, does the reference package in the specification book not have this hot solder pad in the middle? The device itself is not tinned in the middle;
2. In the reference design, there is a hot solder pad and the steel mesh paste layer is also windowed.
Is this one in the middle used for heat dissipation? Is the chip center not tinned? Do you need steel mesh windows?
3. The center of the chip protrudes and is not tinned. It is uncertain whether the steel mesh should be opened, and there is no clear indication from the chip specification sheet. I don't know if opening or not has any impact.
