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IWR6843AOP: Request for Detailed Power Dissipation and Heat Management Information

Part Number: IWR6843AOP

Tool/software:

Hello TI team,

I have a few queries related to the power dissipation and thermal behavior of the radar module:

  • Could you please provide a detailed breakdown of power dissipation for the individual components of the radar, such as Tx, Rx, DSP, LDO, and any other sections? The datasheet currently provides a combined value, but I require separate values for each component. (Specific value of head dissipation by each component is required not combined form)

  • What is the expected heat dissipation when the radar front-end components (e.g., Tx/Rx) are not active or when the radar is not transmitting?

  • If the radar is frequently turned on and off to minimize heat dissipation, what would be the impact on its performance and overall system reliability?

Thanks and Regards,

Dileep Sharma

  • Hi,

    We are looking at your query. Please allow us a couple of days to respond.

    Regards

  • Hi Dileep,

    1. The operation of each individual subsystems such as DSP/Processing highly depends on device configurations especially sampling rate, #Chirps, duty cycle etc. Hence it is difficult to standardize power dissipation for each of these subsystems.

    2. Please refer to the application note: Thermal Design Guide for Antenna on Package mmWave Sensor (https://www.ti.com/lit/an/swra672/swra672.pdf)

    You can use below function or API – to read the junction temperature.

    mmwaveLink_getTemperatureReport()  

    rlRfGetTemperatureReport()

    3. If junction temperature is maintained below 105 deg C, below is the power on hours for the mmWave device.

    You can check using the other knobs to reduce the temperature (Such as duty-cycle, Heat-sink options etc).

    There should not be performance impact for frequent power cycles. But in longer terms it might stress out the PDN.

    Thanks,

    Swarnendu