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TMAG5231: X2SON package height

Priya Lakshmi
Prodigy 60 points
Part Number: TMAG5231

Tool/software:

Hi,

What is the nominal and min height of X2SON-4 package? I see only max specified in the datasheet. This is critical to make sure we have sufficient gap between sensor and magnet for accurate detection.

Thanks,

Priya

  • 0
    TI__Mastermind 21030 points

    Priya,

    Thanks for reaching out on E2E.  The nominal package thickness may vary, but the requirement at assembly is that the device must not exceed the maximum package thickness.  You should target in your mechanical design to always allow for this maximum thickness.

    For accurate placement of the magnet relative to the sensor, we should instead consider the sensing element location within the package.  The main concern here is the height of the lead frame, die attach, and silicon dimensions.  The specification that relates to this height is shown here:

    You should be able to design around the sensing element being roughly 250 um from the surface of the PCB with up to +/-50um of variability in this height.

    Thanks,

    Scott