Hello,
I’m currently working with the TMCS1101 and am in the layout phase of my design.
Are there specific layout guidelines for multilayer boards when using this sensor? Would having a solid copper ground plane directly beneath the sensor and other signal layers impact its performance? Alternatively, would you recommend clearing copper from the area directly underneath the Hall element and the space between the input pins? If so, wouldn’t this introduce magnetic coupling through the air, as observed on the TMCS1101EVM?
Any guidance on optimal layout practices for this device would be greatly appreciated.
Thank you!
