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TMP1827: Thermal Pad connection and ESD protection questions

Part Number: TMP1827
Other Parts Discussed in Thread: ISOTMP35

Tool/software:

Please will you look at the following questions:

  1. The datasheet for this device recommends connecting the Thermal Pad to GND but does not explicitly say if it can be connected to any other connections. Is it possible to connect the pad to Chassis as we would like to measure the temperature of the device casing?
  2. If the above is possible, does the on-chip ESD protection provide suitable protection to the Thermal Pad? The datasheet suggests all pins are ESD protected but it is not clear if this includes the Thermal Pad

Thanks.

  • There is no electrical isolation between thermal pad and GND. Thermal pads have an electrical path to silicon substrate, and can only be electrically connected to GND or left floating. Failure to comply would damage the IC.

    We offer the ISOTMP35 which has 3kV electrical isolation between the silicon and "thermal pad." This is currently the only sensor in our portfolio that can do what you're asking for, but we may offer more devices featuring this package technology in the future.

    thanks,

    ren