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TMP112: Should TMP112AIDRLR meet BTC solder joint inspection criteria?

ken ji
Prodigy 30 points
Part Number: TMP112

Tool/software:

In TPM112 datasheet REVJ  P45,there is a note:

7 .Land pattern design aligns to IPC-610, Bottom Termination Component (BTC) solder joint inspection criteria.

we want to kown  if  TMP112AIDRLR should meet BTC solder joint inspection criteria?  

if no, should TMP112AIDRLR meet the following standard(IPC-A-610 8.3.6.8 )?

Thanks

  • 0
    TI__Mastermind 43715 points

    The note indicates that the recommended land pattern example was designed to meet the IPC-610 standard. The note pertains only to the footprint shown on the page and not to the TMP112 itself. 

    thanks,

    ren

  • 0 in reply to Ren Schackmann
    Prodigy 30 points

    I think PTMP112D0IDPWR  uses X2ON package. it corresponds Bottom Termination Component (BTC) solder joint inspection criteria. However, the TMP112AIDRLR uses SOT563 package. Therefore, the corresponding solder joint inspection criteria should  be  Gull Wing Leads(8.3.6.8)  instead of BTC.

    I think it's ok for Note 7 to appear on the page of X2ON package, but we are confused when it comes to the SOT563 package. Please help us further confirm this.

  • 0 in reply to ken ji
    TI__Mastermind 43715 points

    Your point may be correct; I'm currently not able to access the IPC-610. I've asked our packaging team, who is responsible for this page of the document, for comment. I will update you when I hear from them. 

    ren

  • 0 in reply to Ren Schackmann
    TI__Mastermind 43715 points

    Hi ken,

    Here is the response from our packaging team:

    • IPC doesn’t have a clear package group definition for SOT package.
      It’s grouped under BTC (Bottom Termination Component). Same group as
      QFN and SON.
    • There is no specific definition of solder fillet requirement.
    • Bottom soldering is required. Solder fillet at side wall of the
      leads are not required.
    • IPC recommended PCB land pattern is longer and wider than component
      leads. Intension is to form solder fillet at the side of the leads.

    thanks,

    ren