Tool/software:
Hi,
The formation and growth of whiskers, particularly on metal contacts, can affect the electrical performance of the module and may even lead to short circuits or other electrical failures.
For this project, the customer intends to gain more understanding of the control over [whiskers]. Please assist in answering the following questions:
Q1: Are any forms of tin (Sn), such as Sn, SnAg, SnCu, SnBi, etc., used for lead-free surface treatment on the above parts?
Q2: If so, have appropriate whisker mitigation measures (refer to JEDEC JP002) been implemented, and does the surface treatment meet the JEDEC JESD-201 Class 2 whisker acceptance test requirements?
Q3: Is there a corresponding report available to demonstrate [compliance with the whisker acceptance test requirements]?
Thanks!
Jeff
