AWR1843AOP: Do we need to add paste mask in between AOP die and PCB to make a contact for heat dissipation.

Sapana Shirsat

Part Number: AWR1843AOP

Tool/software:

Hello Team,

We have question here that do we need to add paste mask in between AOP die and PCB to make a contact for heat dissipation?

5 months ago

0 aozer 5 months ago

TI__Mastermind 30895 points

Hello,

We recommend to follow exactly as done on the EVM design files.You can add a thermal interface material between the die and the PCB but it is not required.

AWR1843AOPEVM Evaluation board | TI.com

We also have the below app note which discusses thermal design for additional information.

Thermal Design Guide for Antenna on Package mmWave Sensor

Regards,

Adrian

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AWR1843AOP: Do we need to add paste mask in between AOP die and PCB to make a contact for heat dissipation.