TMP9R00-SP: Recommended land pattern

Hello Yusuke,

Can you explain what you mean by land pattern? We have a layout example for TMP9R00-SP within the datasheet page 33.

Best Regards,

Meredith McKean

Hello Yusuke,

For ceramic packaging with no thermal pad, there has not been a need for an additional land pattern. Outside of the dimensions of the package (which is in the datasheet), the land pattern for the pins is lacking information. Typically we direct customers to Fancort and Spirt Electronics for land patterns. These third parties offers lead forming services. Texas Instruments uses the services of sub-contractors Fancort and Spirit Electronics to derive and implement the desired trim and form profiles which in turn determines the PCB footprints.

Best Regards,

Meredith McKean

Hello Yusuke,

Typically, the customer has specific requests for lead forming for the pins. We simply can't specify lead form as many customers have their own requirements and specifications.

Fancort main customer support email address: cs@fancort.com

CAD footprints are below:

https://vendor.ultralibrarian.com/TI/embedded/?gpn=TMP9R00-SP&package=HKT&pin=16&sid=019737b35ab2001010f778cb67750506f008a06700bd0&c=1&options=1-1&options=2-1

Best Regards,

Meredith McKean