Other Parts Discussed in Thread: TMP119
Tool/software:
Hello,
We’re using the TMP116 in an application where the PCB is secured using screws placed roughly 2 mm away from the sensor package. Both the terminal signal pads and the thermal pad under the package are fully soldered.
In most cases, the sensors operate normally, but we occasionally observe the following behavior on a few units:
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Initially, the sensor communicates correctly and reports accurate temperature measurements.
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After some time, the device stops responding to address requests, returning a NACK on the address byte.
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Reducing the torque on the mounting screws usually restores communication and increasing it leads to loss of communication.
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In a few cases, the affected sensors never recover, even after removing strain.
We understand that excessive localized pressure near the package can lead to device damage. However, what’s intriguing here is the intermittent, reversible communication loss before any apparent permanent failure.
Could you help us understand the potential root causes? Specifically:
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Is this likely due to stress or strain on the silicon die?
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Could it be related to bond wire strain or other internal package mechanical failure?
Thank you!
