AWR6843: AWR6843AQGABLRQ1

Richard Cayer-Barrioz

Part Number: AWR6843

Tool/software:

Hello,

I need a advices regarding the TI MPN AWR6843AQGABLRQ1 we are assembling. After reflow process,to secure the meniscus reliability (Avoiding crack), is it mandatory to apply underfilling material ?
It's a radar chip BGA, functionaly could be worse to apply underfilling, isn't it?

I hope you can help me

Best regards

Richard Cayer-Barrioz

SMT Process Expert

Industrial Engineering

IEE S.A.

12, rue Pierre Richardot

L-6468 Echternach, Luxembourg

Office: +352 2771 2136

E-mail: richard.cayer-barrioz@iee.lu

www.iee-sensing.com

28 days ago

0 Sivaprasad K L 28 days ago

TI__Intellectual 2860 points

Hi Richard,
Similar question has been already answered in the following E2E.

Thanks and Regards,
Sivaprasad

0 Richard Cayer-Barrioz 28 days ago in reply to Sivaprasad K L

Prodigy 10 points

Hello

I haven't access to already existing answer

Richard Cayer-Barrioz

0 Sivaprasad K L 28 days ago in reply to Richard Cayer-Barrioz

TI__Intellectual 2860 points

Hi Richard,
I apologize for that. Please see the response below.
Applying board level underfill will adversely affect RF performance. Therefore, we do not recommend board level underfill for mmWave Radar devices.

Thanks and Regards,
Sivaprasad

0 Richard Cayer-Barrioz 28 days ago in reply to Sivaprasad K L

Prodigy 10 points

Hi Sivaprasad,

Underfilling is not recommended from TI what is the solution to secure the meniscus reliability, avoiding the cracks?

Currently we are checking, by sampling, the PCBA constraints around the BGA below 500 micro-strain on every risky process (ICT, FCT, PCBA attachs milling , final assembly) is it correct?

Best regards

Richard

0 Sivaprasad K L 23 days ago in reply to Richard Cayer-Barrioz

TI__Intellectual 2860 points

Hi Richard,
I apologize for the delay in response. TI performs Board Level Reliability Tests (BGA underfill is not used) and passed on this product (AWR6843).
Please see the appnote which contain the information on reliability tests that TI performs and it also contains TI Soldering guidelines for FCBGA package.

Thanks and Regards,
Sivaprasad

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AWR6843: AWR6843AQGABLRQ1