Tool/software:
Hi E2E team,
I would like to inquire about a discrepancy between the MCD and the SGS report for this material. The MCD indicates that the component includes "plating," but in the SGS report provided by CSC, the test sample for "plating" is labeled as a bump (wafer).
Could you clarify the reason for this inconsistency? Is it a labeling error in the MCD (i.e., bump mistakenly marked as plating), or is the test report incorrect? We tend to believe it is the former, as the listed substances in the composition table—copper, tin, and silver—correspond to the CuSnAg bump wafer in the SGS report. This part appears to match.
