IWRL6432AOP: Regarding terminology related to the APIs rl_fecssRfRuntimeCal and rl_fecssTempMeasCfg

Part Number: IWRL6432AOP

Tool/software:

Q1) About the meaning of PD
The manual states that PD stands for "Peak Detector".
However, I am not sure what a Peak Detector actually is.
Could you please explain what a Peak Detector is?

Q2) About the meaning of LODIST
The manual describes LODIST_BIAS_CODES as "Lo Distribution bias current control codes".
However, I am not sure what "Lo Distribution" refers to.
Could you please explain what Lo Distribution means?

Q3) About the PM temperature sensor
Does "PM" stand for "Power Management"?

Q4) About the DIG temperature sensor
Could you please tell me what "DIG" stands for?

[Referenced]
MMWAVE_L_SDK_05_05_03_00
mmwave_dfp_interface_control_document.pdf

  • Hello.

    Q1) About the meaning of PD
    The manual states that PD stands for "Peak Detector".
    However, I am not sure what a Peak Detector actually is.
    Could you please explain what a Peak Detector is?

    According to this document, "The peak detectors aim at providing an absolute voltage and power reference throughout the radar chip."

    Q2) About the meaning of LODIST
    The manual describes LODIST_BIAS_CODES as "Lo Distribution bias current control codes".
    However, I am not sure what "Lo Distribution" refers to.
    Could you please explain what Lo Distribution means?

    LO Distribution stands for local oscillator distribution.

    Q3) About the PM temperature sensor
    Does "PM" stand for "Power Management"?

    I believe this is stands for power meter.

    Q4) About the DIG temperature sensor
    Could you please tell me what "DIG" stands for?

    [Referenced]

    DIG stands for digital.

    Sincerely,

    Santosh

  • Thank you for the information.
    Would it be possible for you to provide a more detailed explanation of what the digital temperature sensor and the power meter temperature sensor each refer to?
    I would like to deepen my understanding of their respective roles and differences.

  • Nakahira-san, 

    The PM (you were correct, it is indeed the Power Management sensor) and the Digital sensor are both temperature sensors that are part of the analog layout in the SiCMOS. They are responsible for reporting the temperature in their respective portions of the die layout. They are placed roughly central to their particular region. The RX and TX sensors are more important on the chip, as those regions tend to run hotter, but it is important to provide information on the temperature inside the digital and power management regions. 

    I hope this helps. 

    Blake

  • Thank you for the information.
    I’m not quite sure what exactly the "digital and power management regions" refer to.
    In the document swra794b.pdf, the modules that require calibration are shown in the diagram titled mmWave Front End Architecture.


    Based on this diagram, I understand that the region corresponding to the Tx sensor includes the PA, and the region corresponding to the RX sensor includes the LNA.
    Would it be possible to represent the digital region and power management regions in this diagram?
    Or, if there is another document that explains this, could you please share it?

    [Referenced]
    www.ti.com/.../swra794b.pdf

  • Nakahira-san, 

    When i say "region" i could be more specific. The temperature sensors are placed in the vacinity of the the area they purport to monitor. In this case we are talking about the various "regions" of the silicon die itself. 

    The digital sensor is placed to monitor all of the digital (non-RF AFE) and non Power management portions of the chip. This means the RAM, user core, etc.

    If you need specifics that are not layed out in those documents, I'd recomend reaching out to your local TI representetive. 

    I hope this helps!

    Blake