Other Parts Discussed in Thread: TMP390
Tool/software:
Hi,
We are currently evaluating the TMP390-Q1 and have observed a difference between the internal temperature sensor reading and the package surface temperature.
In particular, when external heat is applied to the device, the temperature reported by the sensor differs from the temperature measured at the package surface.
To better understand this behavior, we would like to know if there is a recommended method or model to quantitatively estimate or derive the sensor temperature under such conditions.
Specifically, are there any guidelines, thermal models, or characterization data available to help predict how the internal sensor temperature responds when external heat sources are applied?
Your guidance on this matter would be greatly appreciated.
Best regards,
Conor
