Tool/software:
My production facing poor wetting issue for component TMC102 during Aug 2025 build and component date code are 2324.
What our team observe are component leads issue cause solder paste join at the component.
We had run this model for 3 years and this date code of IC cause production perform 80% of the PCBA touch up on this IC after mount on PCBA.
If it necessary we send some sample to TI for Failure Analysis ?
