Tool/software:
Dear TI Support Team,
In one of our products, we are using the HDC3021-Q1 humidity and temperature sensor. As specified, the device comes with a polyimide tape that covers the opening of the humidity sensor element.
We are planning to protect the electronic components on the PCB using Low-Pressure Molding (LPM) technology. The design is such that the molded material will encapsulate the PCB with a thickness ending approximately 1 mm below the top surface of the sensor element. Our intention is to keep the original polyimide tape in place during the LPM process in order to protect the sensor opening.
Before proceeding, we would like to clarify the following:
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Thermal impact – During LPM, the molding material (typically polyamide) is injected at temperatures around 180–220 °C. Could this temperature negatively affect the sensor element itself (for example, by drying or otherwise altering the internal gel of the sensing structure)?
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Polyimide tape durability – Could the high temperature and pressure conditions of LPM damage, deform, or reduce the protective capability of the polyimide tape that covers the sensor opening?
In short, is it safe to expose the HDC3021-Q1 with its protective polyimide tape to LPM encapsulation, or should we consider an alternative method to protect the sensor element?
Your guidance on this matter would be very valuable for us before moving forward with our design.
Best regards
Ognyan Dimitrov
