TMP117: mechanical qualification report

Part Number: TMP117

Tool/software:

Hi Team, 

I am currently evaluating the TMP117 precision temperature sensor for integration into an Unmanned Aerial Vehicle (UAV) platform. Since the device will be exposed to continuous airborne vibration and potential mechanical shocks, I would like to request the mechanical qualification report for the TMP117.

Specifically, I am seeking details regarding:

  • Vibration analysis (measured in g levels)

  • Frequency range and duration used during qualification testing

  • Shock withstand values (if available)

This information will help us assess the device’s suitability for aerospace-grade environments and ensure reliable operation under UAV flight conditions.

Kindly let me know if the report is available or if there are any recommended guidelines/standards that the TMP117 package has been qualified against.

Looking forward to your support.

  • Hello Pranitha,

    We have not typically tested for shock and vibe testing for our commercial/auto devices. We currently do not have this data for TMP117. Typically, ICs are not affected by shock and vibe especially in encapsulated packages. On a board reliability level, the solder joint could fail. This failure would need to be investigated.

    Best Regards,

    Meredith McKean