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OPT3006: Product Issue about OPT3006

Lumina Gui
Genius 3720 points
Part Number: OPT3006


Dear TI Engineer,

 

Our customer want to confirm the below question about OPT3006, can you help confirm it?

Q1: What is the stacking structure of sensor OPT3006YMFR and what is the approximate location of the sealing layer?
Q2: What are the material characteristics that make this material prone to damage?
Q3: Will simple heating cause material damage or increased cracks?

 

Thanks,

Kind Regards

  • 0
    TI__Expert 5210 points

    Hello Lumina, 

    1) YMFR package is a wafer scale package and does not have a traditional coating. Essentially device is bare die. 

    2) This package can be somewhat susceptible to torque created from flexing of the associated FPCB compared to some of our other package offerings. To combat this many customers utilize a rigidizing layer behind the device. 

    3) Heating within the range allowed by the abs max, storage, and solder profile will pose no threat to device. 

    Thank you, 

    Joseph Scherphorn