• State Resolved
  • Locked Locked
  • Replies 7 replies
  • Answers 2 answers
  • Subscribers 33 subscribers
  • Views 241 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

IWRL6432AOP: Request for Complete Development Documentation for IWRL6432AOP-Based Radar Node Design

Kunal Barot
Prodigy 105 points

Part Number: IWRL6432AOP
Other Parts Discussed in Thread: MMWAVE-L-SDK

Hi TI Support Team,

We are planning to develop a radar node based on the IWRL6432AOP chipset and would like your guidance on the complete development flow.

Could you please share all the relevant reference materials and technical documentation required for product development, including but not limited to:

  • Datasheets (latest revision)

  • Technical Reference Manual (TRM)

  • Hardware design guidelines

  • Antenna-on-package (AoP) design considerations

  • RF layout and PCB design guidelines

  • Power supply design recommendations

  • Thermal design considerations

  • mmWave SDK (latest supported version)

  • Industrial Toolbox / example labs

  • Application notes related to people tracking / occupancy detection

  • Reference schematics and BOM

  • Debugging and calibration documentation

Additionally, please advise on the recommended development tools (EVMs, debuggers, flashing tools, etc.) required to accelerate prototyping and validation.

We would appreciate any guidance on best practices for multi-target tracking and presence detection using this device.

Looking forward to your support.

Thanks & Regards,
KB

  • 0
    Prodigy 105 points

    Hi Support,

    Any update on this ticket.

    Thanks

    KB

  • 0 in reply to Kunal Barot
    TI__Intellectual 2860 points

    Hi Kunal,

    You can find the latest Datasheet and Documentation on the product page for this device.

    You can find the latest version of MMWAVE-L-SDK here.

    For use-case specific applications, and other examples for using and debugging the device, please also install Radar Toolbox.
    (Click on the three dots next to Radar Toolbox 4.00.00.05 and click on Download and Install)

    To get started with a Presence Detection / People Tracking example for 6432AOP, you can check out the example present at this location in Radar Toolbox:
    radar_toolbox\source\ti\examples\Industrial_and_Personal_Electronics\Motion_and_Presence_Detection

    Hope this helps, please feel free to let us know if you are unable to find anything in particular.

    Thanks and Regards,
    Saransh Gautam

  • 0 in reply to Saransh Gautam
    Prodigy 105 points

    Hi Saransh,

    Could you please suggest some labs in India or internationally that can support FCC pre-compliance (pre-scan) testing for our radar device? The radar operates in the 57–63.5 GHz band.

    We are specifically looking for labs with mmWave (60 GHz) testing capability.

    Thanks,
    KB

  • 0 in reply to Kunal Barot
    TI__Intellectual 2860 points

    Hi Kunal,

    I am looping in our HW experts to answer your query.

    Thanks,
    Saransh Gautam

  • 0 in reply to Saransh Gautam
    TI__Genius 10830 points

    Hi Kunal,

    You can check for UL Labs for FCC certifications.

    EMC Testing and Certification | UL

    Regards

    Ankit

  • 0 in reply to Ankit Mohanty
    Prodigy 105 points

    Hi  

    We are currently working on a design using the IWRL6432AOP device and had a few queries regarding antenna orientation and thermal pad implementation.

    From the datasheet, we understand that the AOP antennas (TX/RX) have a defined orientation, and we have followed the same in our PCB design. However, while reviewing the user guide we observed that the evaluation module is rotated in different directions during testing (e.g., mounted on a tripod and rotated left/right).

    https://www.ti.com/lit/pdf/TIDUFE0     (page 23 and Page 26 test setup show different orientation on chip)

    This raised the following questions:

    1. What is the Correct orientation of chip need to place on PCB.

                                                                                                                                     Additionally, we have a query regarding the centre exposed (thermal) pad:

      In the physical IC sample, the center region appears as a solid/shiny block without visible copper . Could you please confirm:

      • Should we given thermal relief pad in our PCB too, since there no such information available in datasheet and in two different EVK design tell different thing

        EVK1 :   www.ti.com/.../IWRL6432AOPEVM

      • Show thermal PAD in layout 

                      while in EVK2 layout design  page 8 of https://www.ti.com/lit/pdf/TIDUFE0    does not sow any such thermal pad.

     

    Looking forward to your guidance.

  • +1 in reply to Kunal Barot
    TI__Genius 10830 points

    Hi  ,

    1. Both are correct orientations. However, the first one shown in the datasheet is the default and preferred orientation. The orientation on the right shall require updating few CLI parameters in configuration file. I would recommend sticking to the placement as suggested in the datasheet.

    2. The opening of solder mask and having thermal/solder paste under the device is a recommended but not mandatory design practice for effective thermal dissipation. The design as in the EVM has solder mask opening, solder paste and GND vias to facilitate heat transfer from the device to the PCB. However, since IWRL632AOP is a low power device we do not observe much heat dissipation from the mmWave device, hence the design in EVM is not mandatory.

    Regards

    Ankit