TMP006 preferred layout details?

Joe Curren57439

Other Parts Discussed in Thread: TMP006

Hello--
TMP006 Layout and Assembly Guidelines (SBOU108) provides a lot of vital layout info...
but what I can't locate is the recommended BGA pad diameter.
Neither the datasheet nor the YZF package doc indicate this (by way of the device pad size
(which implies, at 1:1, the PCB pad size recommended in the MicroStar BGA doc)).

Scaling Figure 11 in the Guidelines to the 500um pitch and 150um traces, it *appears* that
the pads are 300um, but the image is pretty low-res..... an actual value would help a lot.

Thanks!

over 13 years ago

0 Ian Williams over 13 years ago

TI__Mastermind 27715 points

Hello Joe,

The pads are 11 mils in diameter (279.4 um).

Best regards,

Ian Williams
Linear Applications Engineer
Precision Analog and Sensing Products

0 Joe Curren57439 over 13 years ago in reply to Ian Williams

Intellectual 265 points

Thanks Ian! Now the fun begins... -- Joe

0 Basavaraj Hoskeri1 over 12 years ago in reply to Ian Williams

Prodigy 20 points

Dear Joe,

It will be helpful to create footprint for BGA package if you provide complete mechanical specefications.

Basavaraj

0 Hiroshi Sato over 12 years ago in reply to Ian Williams

Expert 2590 points

Hello Ian-san,

Our customer asked us which pad is better for TMP006.

I attached a picture(sorry for in Japanese...), above represents non solder mask defined pad , and below represents solder mask defined pad.

And, please let us know the dimensions Da and Db.

Thanks and best regards,

Hiro

0 Ian Williams over 12 years ago in reply to Hiroshi Sato

TI__Mastermind 27715 points

Hello Hiro-san,

Is it possible for you to translate the Japanese characters in the image? Currently I don't understand what the images are showing me.

Best regards,

Ian Williams
Linear Applications Engineer
Precision Analog

0 Hiroshi Sato over 12 years ago in reply to Ian Williams

Expert 2590 points

Hello Ian-san,

I'm sorry for inconvenience.

I made ppt from customer's picture, please see attached file and give comments.

Thanks.

Hiro

3326.tmp006-solder_mask.ppt

0 Ian Williams over 12 years ago in reply to Hiroshi Sato

TI__Mastermind 27715 points

Hello Hiro-san,

Thank you for the translation.

The most important issue when creating the layout for the TMP006 is that the exposed copper pad area is the same for all of the solder balls. Otherwise, the balls will flow to different heights and therefore the TMP006 will not sit flat on the PCB. This causes performance problems and should be avoided.

The TMP006EVM uses a non-solder mask defined pad. The dimension Da (diameter of the pad) should be 11 mils (0.28mm). The dimension Db is not critical as long as the same amount of copper is exposed on every pad.

Best regards,

Ian Williams

0 Hiroshi Sato over 12 years ago in reply to Ian Williams

Expert 2590 points

Hello Ian-san,

Thank you for your comments, and I'll explain that to the customer.

Thanks and best regards,

Hiro

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TMP006 preferred layout details?