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TMP006 layout, continued:

Joe Curren57439
Intellectual 265 points
Other Parts Discussed in Thread: TMP006

Hello--
In reading the guidelines SBOU108 and forum history, I see that assembly using flux only is the documented process. 
Is there a problem using normal SAC305 paste with organic water-clean flux?
 If the PCBA stencil is excluding the TMP006, then assembly would likely need a second pass to apply flux only before placement.  

Might it make more sense to follow the EVM, and have the TMP006 on a separate little PCBA that uses
the flux-only process?  How does TI spec the EVM assembly?

So many questions, so little time before production... :-)
TIA again -- Joe

 

  • 0
    TI__Mastermind 27715 points

    Hello again Joe,

    I'm going to have to defer these specific assembly-related questions to our technician who has more experience in this area. I'll pass this question along to him and let you know his opinions.

    Best regards,

    Ian Williams

  • 0 in reply to Ian Williams
    TI__Mastermind 27715 points

    Hi Joe,

    The word from our technician is that for the TMP006 no solder paste is necessary. The BGA balls will melt during the reflow process and flow onto the pads, providing a good electrical and mechanical connection. The type of flux isn't critical - any organic, water-soluble flux will do.

    If you are applying a paste+flux combo to the rest of your board, then you would have to do a second flux-only pass for the TMP006. I just looked through the assembly documentation of the TMP006EVM and didn't find any specific instructions regarding flux and solder paste. 

    Best regards,

    Ian Williams

  • 0 in reply to Ian Williams
    Intellectual 265 points

    Ian-- Thanks for the fast response again.  I will pass this onto our assembly vendor and see what they say.

    Is there any chance of TI offering the EVM target part as a product? We actually are using these in our prototypes.
    Kind of like the http://www.ti.com/tool/ez430-t2012  MSP430 target boards....

    Thanks! -- Joe

  • 0 in reply to Joe Curren57439
    TI__Mastermind 27715 points

    Joe,

    I don't think anything like what you suggest has been done before by our group, but for the right business case anything is possible...

    Regards,

    Ian Williams